| Mfg Part Number: P4C187-70CMB | Alternate P/N: P4C18770CMB | NSN : 5962-01-283-4329 |
| NIIN : 012834329 | CAGE Code : 3DTT2 | Manufacturer: Pyramid Semiconductor Corp |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part P4C187-70CMB under NSN 5962-01-283-4329 with 012834329 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Microcircuit Memory items by Pyramid Semiconductor Corp with the CAGE Code 3DTT2 or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part P4C187-70CMB with 5962 Microcircuits Electronic our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.
Proudly operating with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, After Market Aero Spares also operates with a strict NO CHINA Sourcing pledge, ensuring all products purchased are shipped in tandem with their applicable manufacturer trace documentation or qualifying certifications. Dedicated to only supplying premium NSN Part P4C187-70CMB of the highest caliber, experience the simplicity of After Market Aero Spares when you are on the market for specific Pyramid Semiconductor Corp today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-283-4329 Item Description: MICROCIRCUIT MEMORY | 5962 | 012834329 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| SMD1600S-70M | 1 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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