| Mfg Part Number: MB8464-15CV-W-SC | Alternate P/N: MB846415CVWSC | NSN : 5962-01-233-3489 |
| NIIN : 012333489 | CAGE Code : 61271 | Manufacturer: Fujitsu America Inc |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part MB8464-15CV-W-SC under NSN 5962-01-233-3489 with 012333489 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Microcircuit Memory items by Fujitsu America Inc with the CAGE Code 61271 or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part MB8464-15CV-W-SC with 5962 Microcircuits Electronic our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.
Proudly operating with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, After Market Aero Spares also operates with a strict NO CHINA Sourcing pledge, ensuring all products purchased are shipped in tandem with their applicable manufacturer trace documentation or qualifying certifications. Dedicated to only supplying premium NSN Part MB8464-15CV-W-SC of the highest caliber, experience the simplicity of After Market Aero Spares when you are on the market for specific Fujitsu America Inc today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-233-3489 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012333489 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| OW6264CC3-15 | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.460 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 25 INPUT |
| CRHL | UNABLE TO DECODE | UNABLE TO DECODE |
| CSWJ | UNABLE TO DECODE | UNABLE TO DECODE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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