| Mfg Part Number: DPS256X32V3-85B | Alternate P/N: DPS256X32V385B | NSN : 5962-01-394-7210 |
| NIIN : 013947210 | CAGE Code : 66847 | Manufacturer: Dpac Technologies Corp |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part DPS256X32V3-85B under NSN 5962-01-394-7210 with 013947210 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Microcircuit Memory items by Dpac Technologies Corp with the CAGE Code 66847 or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part DPS256X32V3-85B with 5962 Microcircuits Electronic our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.
Proudly operating with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, After Market Aero Spares also operates with a strict NO CHINA Sourcing pledge, ensuring all products purchased are shipped in tandem with their applicable manufacturer trace documentation or qualifying certifications. Dedicated to only supplying premium NSN Part DPS256X32V3-85B of the highest caliber, experience the simplicity of After Market Aero Spares when you are on the market for specific Dpac Technologies Corp today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-394-7210 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013947210 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ES8032-1 | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, 8 MEGABITSRAM MODULE" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| CZES | HYBRID TECHNOLOGY TYPE | MULTICHIP" |
| TTQY | TERMINAL TYPE AND QUANTITY | 66 PIN" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, 8 MEGABITSRAM MODULE" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| CZES | HYBRID TECHNOLOGY TYPE | MULTICHIP" |
| TTQY | TERMINAL TYPE AND QUANTITY | 66 PIN" |
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