61205-90066 With NSN 5961-01-350-1245 by Aai Corporation - Submit Details

Mfg Part Number: 61205-90066 Alternate P/N: 6120590066 NSN : 5961-01-350-1245
NIIN : 013501245 CAGE Code : 97384 Manufacturer: Aai Corporation
Item Name : Semiconductor Device Diode FSC : 5961 Semiconductor Devices and Associated Hardware

Thank you for your interest in NSN Part 61205-90066 under NSN 5961-01-350-1245 with 013501245 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Semiconductor Device Diode items by Aai Corporation with the CAGE Code 97384  or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part 61205-90066 with 5961 Semiconductor Devices and Associated Hardware our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.

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NSN Information for Part Number 61205-90066 with NSN 5961-01-350-1245, 5961013501245

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5961-01-350-1245

Item Description:

SEMICONDUCTOR DEVICE,DIODE

59610135012450N
CIICHCCESDPMICCriticalityENAC
U G
Part NumberISCRNVCRNCCHCCMSDSSADC
61205-90066525

Characteristics Data of NSN 5961-01-350-1245, 5961013501245

MRCCriteriaCharacteristic
ABBHINCLOSURE MATERIALMETAL
ABHPOVERALL LENGTH0.016 INCHES NOMINAL
ABKWOVERALL HEIGHT0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM
ABMKOVERALL WIDTH0.016 INCHES NOMINAL
AFZCFUNCTION FOR WHICH DESIGNEDSWITCHING
CBBLFEATURES PROVIDEDMOUNTING PAD
CTMZSEMICONDUCTOR MATERIALSILICON
CTQXCURRENT RATING PER CHARACTERISTIC10.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK
CTRDPOWER RATING PER CHARACTERISTIC200.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MINIMUM
CTSGMAXIMUM OPERATING TEMP PER MEASUREMENT POINT85.0 DEG CELSIUS AMBIENT AIR
FEATSPECIAL FEATURESTHE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO A GOLD PLATED ALUMINUM GROUND PLANE USING A CONDUCTIVE SILVER FILLED EPOXY; JUNCTION PATTERN ARRANGEMENT: PN
PMLCPRECIOUS MATERIAL AND LOCATIONTERMINAL SURFACES GOLD
PRMTPRECIOUS MATERIALGOLD
TTQYTERMINAL TYPE AND QUANTITY1 BONDING PAD
CTQNVOLTAGE RATING IN VOLTS PER CHARACTERISTIC100.0 MINIMUM BREAKDOWN VOLTAGE, DC
AXGYMOUNTING METHODPRESS FIT
CTRGCAPACITANCE RATING IN PICOFARADS0.1 MAXIMUM

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