Mfg Part Number: 61205-90066 | Alternate P/N: 6120590066 | NSN : 5961-01-350-1245 |
NIIN : 013501245 | CAGE Code : 97384 | Manufacturer: Aai Corporation |
Item Name : Semiconductor Device Diode | FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your interest in NSN Part 61205-90066 under NSN 5961-01-350-1245 with 013501245 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Semiconductor Device Diode items by Aai Corporation with the CAGE Code 97384 or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part 61205-90066 with 5961 Semiconductor Devices and Associated Hardware our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-350-1245 Item Description: SEMICONDUCTOR DEVICE,DIODE | 5961 | 013501245 | 0 | N | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | G | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
61205-90066 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
ABHP | OVERALL LENGTH | 0.016 INCHES NOMINAL |
ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.016 INCHES NOMINAL |
AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
CBBL | FEATURES PROVIDED | MOUNTING PAD |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK |
CTRD | POWER RATING PER CHARACTERISTIC | 200.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MINIMUM |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 DEG CELSIUS AMBIENT AIR |
FEAT | SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO A GOLD PLATED ALUMINUM GROUND PLANE USING A CONDUCTIVE SILVER FILLED EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
PRMT | PRECIOUS MATERIAL | GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
AXGY | MOUNTING METHOD | PRESS FIT |
CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MAXIMUM |
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