| Mfg Part Number: PALC22V10-40DMB | Alternate P/N: PALC22V1040DMB | NSN : 5962-01-349-2199 |
| NIIN : 013492199 | CAGE Code : FAH01 | Manufacturer: 2 Mb Distribution |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part PALC22V10-40DMB under NSN 5962-01-349-2199 with 013492199 featured on After Market Aero Spares. On this page, entities may request a quote for their comparisons on Microcircuit Memory items by 2 Mb Distribution with the CAGE Code FAH01 or begin the purchasing process through the submission of a completed RFQ form. This entails providing details regarding one’s desired part quantities, target prices, estimated shipping time frames, and more, as applicable. Upon submitting a completed form for NSN Part PALC22V10-40DMB with 5962 Microcircuits Electronic our representatives will utilize their market prowess to supply you with a personalized quote backed by rapid lead times and cost savings in just 15 minutes or less.
Proudly operating with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, After Market Aero Spares also operates with a strict NO CHINA Sourcing pledge, ensuring all products purchased are shipped in tandem with their applicable manufacturer trace documentation or qualifying certifications. Dedicated to only supplying premium NSN Part PALC22V10-40DMB of the highest caliber, experience the simplicity of After Market Aero Spares when you are on the market for specific 2 Mb Distribution today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-349-2199 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013492199 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM HEAD 285 | 5 | 1 | 4 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM" |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM" |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR-LOGIC ARRAY" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM" |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM" |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR-LOGIC ARRAY" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
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